A nonlinear fracture mechanics perspective on solder joint failure: Going beyond the Coffin-manson equation

D. Bhate, G. Subbarayan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn-Pb alloys. In this paper, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is developed to predict the crack trajectory and fatigue life of a solder interconnection subjected to both isothermal accelerated thermal and anisothermal power cycling conditions. The model is shown to be similar to well accepted cohesive zone models in its approach and application and is anticipated to be computationally more efficient in a finite element setting. The approach goes beyond empirical modeling in accurately predicting crack trajectories. It is argued that such non-empirical models that capture the physics of material degradation and failure can form the basis for determining meaningful Pb-free solder environmental testing conditions as well as the acceleration factors relative to field use.

Original languageEnglish (US)
Title of host publicationTenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Pages1220-1225
Number of pages6
DOIs
StatePublished - Dec 22 2006
Externally publishedYes
Event10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 - San Diego, CA, United States
Duration: May 30 2006Jun 2 2006

Publication series

NameThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
Volume2006

Other

Other10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
CountryUnited States
CitySan Diego, CA
Period5/30/066/2/06

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Keywords

  • Acceleration factors
  • Cohesive zone modeling
  • Lead-free solder

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Bhate, D., & Subbarayan, G. (2006). A nonlinear fracture mechanics perspective on solder joint failure: Going beyond the Coffin-manson equation. In Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 (pp. 1220-1225). [1645484] (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference; Vol. 2006). https://doi.org/10.1109/ITHERM.2006.1645484