A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints

Dhruv Bhate, D. Chan, G. Subbarayan, L. Nguyen

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the importance of the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn-Pb alloys. In this paper, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is developed to predict the crack trajectory and fatigue life of a solder interconnection. The model is shown to be similar to well accepted cohesive zone models in its theoretical development and application and is anticipated to be computationally more efficient compared to cohesive zone models in a finite element setting. The approach goes beyond empirical modeling in accurately predicting crack trajectories and is validated against experiments performed on lead-free as well as Sn-Pb solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique.

Original languageEnglish (US)
Pages (from-to)210031-210039
Number of pages9
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume130
Issue number2
DOIs
StatePublished - Jun 1 2008
Externally publishedYes

Fingerprint

Fatigue crack propagation
Fracture mechanics
Soldering alloys
Fatigue of materials
Trajectories
Cracks
Thermal cycling
Microelectronics
Creep
Lead
Experiments

Keywords

  • Acceleration factors
  • Cohesive zone modeling
  • Lead-free solder

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints. / Bhate, Dhruv; Chan, D.; Subbarayan, G.; Nguyen, L.

In: Journal of Electronic Packaging, Transactions of the ASME, Vol. 130, No. 2, 01.06.2008, p. 210031-210039.

Research output: Contribution to journalArticle

@article{5d7f09467da9448a92b9f2a143bf65e7,
title = "A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints",
abstract = "Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the importance of the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn-Pb alloys. In this paper, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is developed to predict the crack trajectory and fatigue life of a solder interconnection. The model is shown to be similar to well accepted cohesive zone models in its theoretical development and application and is anticipated to be computationally more efficient compared to cohesive zone models in a finite element setting. The approach goes beyond empirical modeling in accurately predicting crack trajectories and is validated against experiments performed on lead-free as well as Sn-Pb solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique.",
keywords = "Acceleration factors, Cohesive zone modeling, Lead-free solder",
author = "Dhruv Bhate and D. Chan and G. Subbarayan and L. Nguyen",
year = "2008",
month = "6",
day = "1",
doi = "10.1115/1.2840057",
language = "English (US)",
volume = "130",
pages = "210031--210039",
journal = "Journal of Electronic Packaging, Transactions of the ASME",
issn = "1043-7398",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "2",

}

TY - JOUR

T1 - A nonlinear fracture mechanics approach to modeling fatigue crack growth in solder joints

AU - Bhate, Dhruv

AU - Chan, D.

AU - Subbarayan, G.

AU - Nguyen, L.

PY - 2008/6/1

Y1 - 2008/6/1

N2 - Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the importance of the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn-Pb alloys. In this paper, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is developed to predict the crack trajectory and fatigue life of a solder interconnection. The model is shown to be similar to well accepted cohesive zone models in its theoretical development and application and is anticipated to be computationally more efficient compared to cohesive zone models in a finite element setting. The approach goes beyond empirical modeling in accurately predicting crack trajectories and is validated against experiments performed on lead-free as well as Sn-Pb solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique.

AB - Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the importance of the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder joints, designing accelerated thermal cycling tests and estimating the fatigue life are challenged by the significantly different creep behavior relative to Sn-Pb alloys. In this paper, a hybrid fatigue modeling approach inspired by nonlinear fracture mechanics is developed to predict the crack trajectory and fatigue life of a solder interconnection. The model is shown to be similar to well accepted cohesive zone models in its theoretical development and application and is anticipated to be computationally more efficient compared to cohesive zone models in a finite element setting. The approach goes beyond empirical modeling in accurately predicting crack trajectories and is validated against experiments performed on lead-free as well as Sn-Pb solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique.

KW - Acceleration factors

KW - Cohesive zone modeling

KW - Lead-free solder

UR - http://www.scopus.com/inward/record.url?scp=47749146927&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=47749146927&partnerID=8YFLogxK

U2 - 10.1115/1.2840057

DO - 10.1115/1.2840057

M3 - Article

VL - 130

SP - 210031

EP - 210039

JO - Journal of Electronic Packaging, Transactions of the ASME

JF - Journal of Electronic Packaging, Transactions of the ASME

SN - 1043-7398

IS - 2

ER -