A new simulation method for NBTI analysis in SPICE environment

Rakesh Vattikonda, Yansheng Luo, Alex Gyure, Xiaoning Qi, Sam Lo, Mahmoud Shahram, Yu Cao, Kishore Singhal, Dino Toffolon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

This paper presents a simulation framework for reliability analysis of circuits in the SPICE environment. The framework incorporates the degradation of physical parameters such as threshold voltage (Vtp) into circuit simulation and enables the design of highly reliable circuits. The parameter degradation is based on the numerical solution for the reaction-diffusion (R-D) mechanism, which is a general model applicable to various reliability effects such as NBTI, HCI, NCS, and SEE. In particular, the accuracy and efficiency of this method was verified for NBTI degradation with 130nm experimental and simulation data over a wide range of stress voltages and temperature. The model also accurately captures the dependence of NBTI on multiple diffusion species (H/H2,), key process (Pth, tox) and environmental parameters (VDD, temperature). The circuit level performance of this method is verified with silicon data from ring-oscillator circuit. We also investigated the predicted impact of NBTI on representative digital circuits.

Original languageEnglish (US)
Title of host publicationProceedings - Eighth International Symposium on Quality Electronic Design, ISQED 2007
Pages41-46
Number of pages6
DOIs
StatePublished - 2007
Event8th International Symposium on Quality Electronic Design, ISQED 2007 - San Jose, CA, United States
Duration: Mar 26 2007Mar 28 2007

Other

Other8th International Symposium on Quality Electronic Design, ISQED 2007
CountryUnited States
CitySan Jose, CA
Period3/26/073/28/07

Fingerprint

SPICE
Networks (circuits)
Degradation
Circuit simulation
Digital circuits
Human computer interaction
Reliability analysis
Threshold voltage
Silicon
Temperature
Negative bias temperature instability
Electric potential

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Vattikonda, R., Luo, Y., Gyure, A., Qi, X., Lo, S., Shahram, M., ... Toffolon, D. (2007). A new simulation method for NBTI analysis in SPICE environment. In Proceedings - Eighth International Symposium on Quality Electronic Design, ISQED 2007 (pp. 41-46). [4149009] https://doi.org/10.1109/ISQED.2007.21

A new simulation method for NBTI analysis in SPICE environment. / Vattikonda, Rakesh; Luo, Yansheng; Gyure, Alex; Qi, Xiaoning; Lo, Sam; Shahram, Mahmoud; Cao, Yu; Singhal, Kishore; Toffolon, Dino.

Proceedings - Eighth International Symposium on Quality Electronic Design, ISQED 2007. 2007. p. 41-46 4149009.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vattikonda, R, Luo, Y, Gyure, A, Qi, X, Lo, S, Shahram, M, Cao, Y, Singhal, K & Toffolon, D 2007, A new simulation method for NBTI analysis in SPICE environment. in Proceedings - Eighth International Symposium on Quality Electronic Design, ISQED 2007., 4149009, pp. 41-46, 8th International Symposium on Quality Electronic Design, ISQED 2007, San Jose, CA, United States, 3/26/07. https://doi.org/10.1109/ISQED.2007.21
Vattikonda R, Luo Y, Gyure A, Qi X, Lo S, Shahram M et al. A new simulation method for NBTI analysis in SPICE environment. In Proceedings - Eighth International Symposium on Quality Electronic Design, ISQED 2007. 2007. p. 41-46. 4149009 https://doi.org/10.1109/ISQED.2007.21
Vattikonda, Rakesh ; Luo, Yansheng ; Gyure, Alex ; Qi, Xiaoning ; Lo, Sam ; Shahram, Mahmoud ; Cao, Yu ; Singhal, Kishore ; Toffolon, Dino. / A new simulation method for NBTI analysis in SPICE environment. Proceedings - Eighth International Symposium on Quality Electronic Design, ISQED 2007. 2007. pp. 41-46
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