Abstract

In recent years, silicon photovoltaic technologies utilizing amorphous silicon (a-Si) to form heterojunction solar cells with thin passivating layers have consistently demonstrated high efficiencies (world record of 25.6%), high fill factor's (FF) and high open circuit voltages (VOC). Further improvements in efficiency require a rigorous approach to better understand and improve device behavior. In this work we analyze the transport and device performance of heterojunction cell by applying a multiscale simulation methodology. Our multiscale solver consists of three primary domains, namely; the drift-diffusion (DD) domain, the ensemble Monte Carlo (EMC) and the kinetic Monte Carlo (KMC) domain. We investigate the role of midgap defects in the a-Si and interface defects at the crystalline silicon (c-Si) and a- Si heterointerface. Simulations indicate that recombination at the interface is a key limiting factor in device performance and contributes to the 'S' shaped current voltage characteristic.

Original languageEnglish (US)
Title of host publicationIMAPS 12th International Conference and Exhibition on Device Packaging
PublisherIMAPS-International Microelectronics and Packaging Society
StatePublished - 2016
EventIMAPS 12th International Conference and Exhibition on Device Packaging - Fountain Hills, United States
Duration: Mar 14 2016Mar 17 2016

Other

OtherIMAPS 12th International Conference and Exhibition on Device Packaging
CountryUnited States
CityFountain Hills
Period3/14/163/17/16

Keywords

  • Amorphous silicon
  • Device modeling
  • Heterojunction
  • Solar cells

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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  • Cite this

    Muralidharan, P., Bowden, S., Goodnick, S., & Vasileska, D. (2016). A multiscale modeling approach to study transport in silicon heterojunction solar cells. In IMAPS 12th International Conference and Exhibition on Device Packaging IMAPS-International Microelectronics and Packaging Society.