A multiscale damage accumulation theory for solder joint failure

Dhruv Bhate, Kaushik Mysore, Ganesh Subbarayan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In heterogeneous microstructures that include several grains, secondary phases and interfaces, cracks are known to initiate and grow through different mechanisms. The failure processes however are not well understood. Solder alloys in general, and Pb-free alloys in particular possess complex, heterogeneous microstructures that evolve in fracture in ways that are challenging to model. Often, underlying a fracture observed under a microscope is a hierarchy of fracture-related phenomenon from atomic to macro length-scales. In this paper we develop a failure model inspired by information theory and continuum thermodynamics to capture the multiscale fracture processes in solder joints. We systematically develop measures of dissipation from continuum thermodynamics for materials described by J2 plasticity theory. Crack growth is known to be dissipative and such measures are natural candidates for predicting failure within a mechanics framework. The dissipation estimates, multiple fracture mechanisms and the notions of continuity, monotonicity and composition borrowed from information theory suggest a single model as being capable of predicting both ductile and brittle types of failures.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages191-197
Number of pages7
Volume2
DOIs
StatePublished - Jun 30 2010
Externally publishedYes
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: Jul 19 2009Jul 23 2009

Other

Other2009 ASME InterPack Conference, IPACK2009
CountryUnited States
CitySan Francisco, CA
Period7/19/097/23/09

Fingerprint

Soldering alloys
Information theory
Thermodynamics
Microstructure
Plasticity
Macros
Crack propagation
Mechanics
Microscopes
Cracks
Chemical analysis

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Bhate, D., Mysore, K., & Subbarayan, G. (2010). A multiscale damage accumulation theory for solder joint failure. In Proceedings of the ASME InterPack Conference 2009, IPACK2009 (Vol. 2, pp. 191-197) https://doi.org/10.1115/InterPACK2009-89399

A multiscale damage accumulation theory for solder joint failure. / Bhate, Dhruv; Mysore, Kaushik; Subbarayan, Ganesh.

Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2 2010. p. 191-197.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bhate, D, Mysore, K & Subbarayan, G 2010, A multiscale damage accumulation theory for solder joint failure. in Proceedings of the ASME InterPack Conference 2009, IPACK2009. vol. 2, pp. 191-197, 2009 ASME InterPack Conference, IPACK2009, San Francisco, CA, United States, 7/19/09. https://doi.org/10.1115/InterPACK2009-89399
Bhate D, Mysore K, Subbarayan G. A multiscale damage accumulation theory for solder joint failure. In Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2. 2010. p. 191-197 https://doi.org/10.1115/InterPACK2009-89399
Bhate, Dhruv ; Mysore, Kaushik ; Subbarayan, Ganesh. / A multiscale damage accumulation theory for solder joint failure. Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2 2010. pp. 191-197
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