A model predictive control strategy for supply chain management in semiconductor manufacturing under uncertainty

Wenlin Wang, Daniel Rivera, Karl G. Kempf, Kirk D. Smith

Research output: Chapter in Book/Report/Conference proceedingConference contribution

22 Scopus citations

Abstract

Model Predictive Control (MPC) is presented as a tactical decision module for supply chain management in semiconductor manufacturing. A representative problem which includes distinguishing features of semiconductor manufacturing supply chains, such as material reconfiguration and stochastic product splits, is examined. Fluid analogies are used to model the supply chain dynamics, with stochasticity and nonlinearity occurring on the throughput time, yield and customer demand. Given inventory targets and capacity limits, MPC using linear time invariant models can make the system outputs track the targets and improve customer service levels. The flexibility provided by the choice of tuning parameters in MPC to achieve better performance and robustness in semiconductor manufacturing supply chain management is demonstrated.

Original languageEnglish (US)
Title of host publicationProceedings of the 2004 American Control Conference (AAC)
Pages4577-4582
Number of pages6
DOIs
StatePublished - Nov 29 2004
EventProceedings of the 2004 American Control Conference (AAC) - Boston, MA, United States
Duration: Jun 30 2004Jul 2 2004

Publication series

NameProceedings of the American Control Conference
Volume5
ISSN (Print)0743-1619

Other

OtherProceedings of the 2004 American Control Conference (AAC)
CountryUnited States
CityBoston, MA
Period6/30/047/2/04

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Wang, W., Rivera, D., Kempf, K. G., & Smith, K. D. (2004). A model predictive control strategy for supply chain management in semiconductor manufacturing under uncertainty. In Proceedings of the 2004 American Control Conference (AAC) (pp. 4577-4582). (Proceedings of the American Control Conference; Vol. 5). https://doi.org/10.1109/ACC.2004.182673