A mechanically stretchable temperature sensor based on buckled thin film devices on an elastomeric substrate

Cunjiang Yu, Ziyu Wang, Jie Zhu, Xiaotun Qiu, Oiler Jon, Hongyu Yu, Hanqing Jiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Stretchable electronics and sensors have been attracting significant attention due to their unique characteristics and wide applications. This paper demonstrates a prototype of a fully stretchable temperature sensor on an elastomeric substrate. The sensor was first fabricated on a silicon-on-insulator (SOI) wafer and then transferred to a pre-strained elastomeric polydimethylsiloxane (PDMS) substrate. Releasing the pre-strain on the PDMS substrate led to the formation of the microscale, periodic, wavy geometries of the sensor. The thin wavy sensor device can be reversibly bent and stretched up to 30% strain without any damage or performance degradation. A theoretical analysis was also developed to estimate the wavy profile.

Original languageEnglish (US)
Title of host publicationMEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
Pages675-678
Number of pages4
DOIs
StatePublished - Jun 1 2010
Event23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, China
Duration: Jan 24 2010Jan 28 2010

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
CountryChina
CityHong Kong
Period1/24/101/28/10

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Yu, C., Wang, Z., Zhu, J., Qiu, X., Jon, O., Yu, H., & Jiang, H. (2010). A mechanically stretchable temperature sensor based on buckled thin film devices on an elastomeric substrate. In MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest (pp. 675-678). [5442318] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2010.5442318