TY - GEN
T1 - A mechanically stretchable temperature sensor based on buckled thin film devices on an elastomeric substrate
AU - Yu, Cunjiang
AU - Wang, Ziyu
AU - Zhu, Jie
AU - Qiu, Xiaotun
AU - Jon, Oiler
AU - Yu, Hongyu
AU - Jiang, Hanqing
PY - 2010
Y1 - 2010
N2 - Stretchable electronics and sensors have been attracting significant attention due to their unique characteristics and wide applications. This paper demonstrates a prototype of a fully stretchable temperature sensor on an elastomeric substrate. The sensor was first fabricated on a silicon-on-insulator (SOI) wafer and then transferred to a pre-strained elastomeric polydimethylsiloxane (PDMS) substrate. Releasing the pre-strain on the PDMS substrate led to the formation of the microscale, periodic, wavy geometries of the sensor. The thin wavy sensor device can be reversibly bent and stretched up to 30% strain without any damage or performance degradation. A theoretical analysis was also developed to estimate the wavy profile.
AB - Stretchable electronics and sensors have been attracting significant attention due to their unique characteristics and wide applications. This paper demonstrates a prototype of a fully stretchable temperature sensor on an elastomeric substrate. The sensor was first fabricated on a silicon-on-insulator (SOI) wafer and then transferred to a pre-strained elastomeric polydimethylsiloxane (PDMS) substrate. Releasing the pre-strain on the PDMS substrate led to the formation of the microscale, periodic, wavy geometries of the sensor. The thin wavy sensor device can be reversibly bent and stretched up to 30% strain without any damage or performance degradation. A theoretical analysis was also developed to estimate the wavy profile.
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U2 - 10.1109/MEMSYS.2010.5442318
DO - 10.1109/MEMSYS.2010.5442318
M3 - Conference contribution
AN - SCOPUS:77952786496
SN - 9781424457649
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 675
EP - 678
BT - MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
T2 - 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
Y2 - 24 January 2010 through 28 January 2010
ER -