A mechanical fatigue damage evolution model for PB-free solder materials

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Evaluating state of damage in a ductile material as it experiences mechanical fatigue and cyclic loading poses much complexity and has been the subject of many researches. This study revisits the anisotropic damage model developed by Lemaitre (1992) and proposes to use his model combined with a micro-mechanics and mechanism based damage evolution model (Energy Partitioning Damage Evolution (EPDE)) and also a Unified Creep Plasticity-based model to predict the state of damage. The model is examined for pure shear and is applied to Pb-free solder materials. New anisotropic damage model exponents are generated using experimental data for Pb-free solder for both EPDE and UPC-based models and are compared with exponents generated previously under the assumption of isotropic and homogenous damage evolution.

Original languageEnglish (US)
Title of host publication2008 Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE 2008
Pages603-609
Number of pages7
EditionPART A
DOIs
StatePublished - 2009
Externally publishedYes
Event2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008 - Boston, MA, United States
Duration: Oct 31 2008Nov 6 2008

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings
NumberPART A
Volume13

Other

Other2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008
CountryUnited States
CityBoston, MA
Period10/31/0811/6/08

Keywords

  • Continuum damage mechanics solder
  • Cyclic fatigue
  • Micro-electronics

ASJC Scopus subject areas

  • Mechanical Engineering

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