A Hybrid Process for Printing Pure and High Conductivity Nanocrystalline Copper and Nickel on Flexible Polymeric Substrates

Md Emran Hossain Bhuiyan, Ali Behroozfar, Soheil Daryadel, Salvador Moreno, Seyedreza Morsali, Majid Minary-Jolandan

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

Printing functional devices on flexible substrates requires printing of high conductivity metallic patterns. To prevent deformation and damage of the polymeric substrate, the processing (printing) and post-processing (annealing) temperature of the metal patterns must be lower than the glass transition temperature of the substrate. Here, a hybrid process including deposition of a sacrificial blanket thin film, followed by room environment nozzle-based electrodeposition, and subsequent etching of the blanket film is demonstrated to print pure and nanocrystalline metallic (Ni and Cu) patterns on flexible substrates (PI and PET). Microscopy and spectroscopy showed that the printed metal is nanocrystalline, solid with no porosity and with low impurities. Electrical resistivity close to the bulk (~2-time) was obtained without any thermal annealing. Mechanical characterization confirmed excellent cyclic strength of the deposited metal, with limited degradation under high cyclic flexure. Several devices including radio frequency identification (RFID) tag, heater, strain gauge, and temperature sensor are demonstrated.

Original languageEnglish (US)
Article number19032
JournalScientific reports
Volume9
Issue number1
DOIs
StatePublished - Dec 1 2019
Externally publishedYes

ASJC Scopus subject areas

  • General

Fingerprint

Dive into the research topics of 'A Hybrid Process for Printing Pure and High Conductivity Nanocrystalline Copper and Nickel on Flexible Polymeric Substrates'. Together they form a unique fingerprint.

Cite this