A Generic Multi-Chip Module Using Vertical Insertion Technique

Junseok Chae (Inventor)

Research output: Patent

Abstract

The objective of this project is to design, develop and demonstrate hybrid integration of multiple substrates on a single microfabricated platform, encapsulated to be implantable for biomedical applications. Although monolithic integration has been quite successful to deliver small-sized, low-power, and inexpensive systems, many applications including high-end communication and space/biomedical systems require multi-chip solution due to incompatible fabrication technologies or simply different substrate materials. We propose a new wirebond-free, area efficient, multi-substrate assembly technique which can accommodate multiple sizes, shapes, fabrication technologies, and substrates on a single microfabricated platform with the resulting assembly module fully encapsulated to be implantable for biomedical applications. The implantable multi-chip module utilizes:1) polymer cables2) an interconnection techniques using surface chemistry3) mold chip transfer and4) dielectric layer coating for hermetic encapsulation.As a demonstration of this multi-ciop solution, a CMOS module that contains multi-channel expandable data converters, an RF to DC power conversion module
Original languageEnglish (US)
StatePublished - Oct 26 2005

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Substrates
Fabrication
Encapsulation
Demonstrations
Coatings
Communication
Polymers

Cite this

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title = "A Generic Multi-Chip Module Using Vertical Insertion Technique",
abstract = "The objective of this project is to design, develop and demonstrate hybrid integration of multiple substrates on a single microfabricated platform, encapsulated to be implantable for biomedical applications. Although monolithic integration has been quite successful to deliver small-sized, low-power, and inexpensive systems, many applications including high-end communication and space/biomedical systems require multi-chip solution due to incompatible fabrication technologies or simply different substrate materials. We propose a new wirebond-free, area efficient, multi-substrate assembly technique which can accommodate multiple sizes, shapes, fabrication technologies, and substrates on a single microfabricated platform with the resulting assembly module fully encapsulated to be implantable for biomedical applications. The implantable multi-chip module utilizes:1) polymer cables2) an interconnection techniques using surface chemistry3) mold chip transfer and4) dielectric layer coating for hermetic encapsulation.As a demonstration of this multi-ciop solution, a CMOS module that contains multi-channel expandable data converters, an RF to DC power conversion module",
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