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A field evaluation of the potential for creep in thermoplastic encapsulant materials
Michael D. Kempe, David C. Miller, John H. Wohlgemuth, Sarah R. Kurtz, John M. Moseley, Qurat Shah, Govindasamy Tamizhmani, Keiichiro Sakurai, Masanao Inoue, Takuya Doi, Atsushi Masuda, Sam L. Samuels, Crystal E. Vanderpan
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
8
Scopus
citations