A field evaluation of the potential for creep in thermoplastic encapsulant materials

Michael D. Kempe, David C. Miller, John H. Wohlgemuth, Sarah R. Kurtz, John M. Moseley, Qurat Shah, Govindasamy Tamizhmani, Keiichiro Sakurai, Masanao Inoue, Takuya Doi, Atsushi Masuda, Sam L. Samuels, Crystal E. Vanderpan

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    4 Scopus citations

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    Engineering & Materials Science