A field evaluation of the potential for creep in thermoplastic encapsulant materials

Michael D. Kempe, David C. Miller, John H. Wohlgemuth, Sarah R. Kurtz, John M. Moseley, Qurat Shah, Govindasamy Tamizhmani, Keiichiro Sakurai, Masanao Inoue, Takuya Doi, Atsushi Masuda, Sam L. Samuels, Crystal E. Vanderpan

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Scopus citations

    Abstract

    There has been recent interest in the use of thermoplastic encapsulant materials in photovoltaic modules to replace chemically crosslinked materials, e.g., ethylene-vinyl acetate. The related motivations include the desire to: reduce lamination time or temperature; use less moisture-permeable materials; use materials with better corrosion characteristics or with improved electrical resistance. However, the use of any thermoplastic material in a high-temperature environment raises safety and performance concerns, as the standardized tests currently do not expose the modules to temperatures in excess of 85°C, though fielded modules may experience temperatures above 100°C. Here we constructed eight pairs of crystalline-silicon modules and eight pairs of glass/encapsulation/glass thin-film mock modules using different encapsulant materials of which only two were designed to chemically crosslink. One module set was exposed outdoors with insulation on the back side in Arizona in the summer, and an identical set was exposed in environmental chambers. High precision creep measurements (±20 μm) and performance measurements indicate that despite many of these polymeric materials being in the melt state during outdoor deployment, very little creep was seen because of their high viscosity, temperature heterogeneity across the modules, and the formation of chemical crosslinks in many of the encapsulants as they aged. In the case of the crystalline silicon modules, the physical restraint of the backsheet reduced the creep further.

    Original languageEnglish (US)
    Title of host publicationProgram - 38th IEEE Photovoltaic Specialists Conference, PVSC 2012
    Pages1871-1876
    Number of pages6
    DOIs
    StatePublished - Nov 26 2012
    Event38th IEEE Photovoltaic Specialists Conference, PVSC 2012 - Austin, TX, United States
    Duration: Jun 3 2012Jun 8 2012

    Publication series

    NameConference Record of the IEEE Photovoltaic Specialists Conference
    ISSN (Print)0160-8371

    Other

    Other38th IEEE Photovoltaic Specialists Conference, PVSC 2012
    CountryUnited States
    CityAustin, TX
    Period6/3/126/8/12

    Keywords

    • Creep
    • Encapsulant
    • Polymer
    • Qualification Standards
    • Thermoplastic

    ASJC Scopus subject areas

    • Control and Systems Engineering
    • Industrial and Manufacturing Engineering
    • Electrical and Electronic Engineering

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  • Cite this

    Kempe, M. D., Miller, D. C., Wohlgemuth, J. H., Kurtz, S. R., Moseley, J. M., Shah, Q., Tamizhmani, G., Sakurai, K., Inoue, M., Doi, T., Masuda, A., Samuels, S. L., & Vanderpan, C. E. (2012). A field evaluation of the potential for creep in thermoplastic encapsulant materials. In Program - 38th IEEE Photovoltaic Specialists Conference, PVSC 2012 (pp. 1871-1876). [6317958] (Conference Record of the IEEE Photovoltaic Specialists Conference). https://doi.org/10.1109/PVSC.2012.6317958