Abstract

We present an in-situ non-volatile tuning method for adjusting MEMS microphone sensitivity using integrated nano-electrodeposits to achieve high directionality in hearing aids. Using a DC bias at room temperature, nano-electrodeposits are electrochemically formed on a Ag-Ge-Se solid electrolyte film integrated with a microphone diaphragm. The in-situ growth mechanism generates mass/stress redistribution on the diaphragm, tuning microphone sensitivity to incoming acoustic sources. Acoustic measurements demonstrate the technique can achieve a tuning range of 1.67 dB (24%), corresponding to a 1.1 7-dB Directivity Index (DI) improvement, which is sufficient to enable acoustic directionality in high accuracy microphone arrays.

Original languageEnglish (US)
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages96-99
Number of pages4
DOIs
StatePublished - 2009
Event22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy
Duration: Jan 25 2009Jan 29 2009

Other

Other22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009
CountryItaly
CitySorrento
Period1/25/091/29/09

Fingerprint

Microphones
microphones
Tuning
Acoustics
tuning
diaphragms
Diaphragms
Hearing aids
acoustic measurement
acoustics
sensitivity
Solid electrolytes
solid electrolytes
directivity
hearing
microelectromechanical systems
MEMS
direct current
adjusting
room temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Je, S. S., Kim, J., Kozicki, M., & Chae, J. (2009). A directional capacitive mems microphone using nano-Electrodeposits. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 96-99). [4805328] https://doi.org/10.1109/MEMSYS.2009.4805328

A directional capacitive mems microphone using nano-Electrodeposits. / Je, Sang Soo; Kim, Jeonghwan; Kozicki, Michael; Chae, Junseok.

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2009. p. 96-99 4805328.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Je, SS, Kim, J, Kozicki, M & Chae, J 2009, A directional capacitive mems microphone using nano-Electrodeposits. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)., 4805328, pp. 96-99, 22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009, Sorrento, Italy, 1/25/09. https://doi.org/10.1109/MEMSYS.2009.4805328
Je SS, Kim J, Kozicki M, Chae J. A directional capacitive mems microphone using nano-Electrodeposits. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2009. p. 96-99. 4805328 https://doi.org/10.1109/MEMSYS.2009.4805328
Je, Sang Soo ; Kim, Jeonghwan ; Kozicki, Michael ; Chae, Junseok. / A directional capacitive mems microphone using nano-Electrodeposits. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). 2009. pp. 96-99
@inproceedings{c598988327ef412f91ae3bfe77c1e0f2,
title = "A directional capacitive mems microphone using nano-Electrodeposits",
abstract = "We present an in-situ non-volatile tuning method for adjusting MEMS microphone sensitivity using integrated nano-electrodeposits to achieve high directionality in hearing aids. Using a DC bias at room temperature, nano-electrodeposits are electrochemically formed on a Ag-Ge-Se solid electrolyte film integrated with a microphone diaphragm. The in-situ growth mechanism generates mass/stress redistribution on the diaphragm, tuning microphone sensitivity to incoming acoustic sources. Acoustic measurements demonstrate the technique can achieve a tuning range of 1.67 dB (24{\%}), corresponding to a 1.1 7-dB Directivity Index (DI) improvement, which is sufficient to enable acoustic directionality in high accuracy microphone arrays.",
author = "Je, {Sang Soo} and Jeonghwan Kim and Michael Kozicki and Junseok Chae",
year = "2009",
doi = "10.1109/MEMSYS.2009.4805328",
language = "English (US)",
pages = "96--99",
booktitle = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

}

TY - GEN

T1 - A directional capacitive mems microphone using nano-Electrodeposits

AU - Je, Sang Soo

AU - Kim, Jeonghwan

AU - Kozicki, Michael

AU - Chae, Junseok

PY - 2009

Y1 - 2009

N2 - We present an in-situ non-volatile tuning method for adjusting MEMS microphone sensitivity using integrated nano-electrodeposits to achieve high directionality in hearing aids. Using a DC bias at room temperature, nano-electrodeposits are electrochemically formed on a Ag-Ge-Se solid electrolyte film integrated with a microphone diaphragm. The in-situ growth mechanism generates mass/stress redistribution on the diaphragm, tuning microphone sensitivity to incoming acoustic sources. Acoustic measurements demonstrate the technique can achieve a tuning range of 1.67 dB (24%), corresponding to a 1.1 7-dB Directivity Index (DI) improvement, which is sufficient to enable acoustic directionality in high accuracy microphone arrays.

AB - We present an in-situ non-volatile tuning method for adjusting MEMS microphone sensitivity using integrated nano-electrodeposits to achieve high directionality in hearing aids. Using a DC bias at room temperature, nano-electrodeposits are electrochemically formed on a Ag-Ge-Se solid electrolyte film integrated with a microphone diaphragm. The in-situ growth mechanism generates mass/stress redistribution on the diaphragm, tuning microphone sensitivity to incoming acoustic sources. Acoustic measurements demonstrate the technique can achieve a tuning range of 1.67 dB (24%), corresponding to a 1.1 7-dB Directivity Index (DI) improvement, which is sufficient to enable acoustic directionality in high accuracy microphone arrays.

UR - http://www.scopus.com/inward/record.url?scp=65949086195&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65949086195&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2009.4805328

DO - 10.1109/MEMSYS.2009.4805328

M3 - Conference contribution

SP - 96

EP - 99

BT - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

ER -