A Deep-Learning-Based Surrogate Model for Thermal Signature Prediction in Laser Metal Deposition

Shenghan Guo, Weihong Guo, Linkan Bian, Y. B. Guo

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


Laser metal deposition (LMD) is an additive manufacturing method for metal parts by using focused thermal energy to fuse materials as they are deposited. During LMD, transient thermal signatures such as the in-situ thermal images of melt pool, contain rich information about process performance. Early prediction of such transient thermal signatures provides opportunities for process monitoring and defect prevention. While physics-based models of LMD have been conventionally used for thermal signature prediction, they have limitations and are computationally expensive for real-time prediction. A scalable, efficient data-science-based model is therefore needed. This paper develops a deep-learning-based surrogate model, called LMD-cGAN, to predict and emulate the transient thermal signatures in LMD. The model generates images for the thermal dynamics of melt pool conditionally on the deposition layer. It enables early prediction of future-layer thermal signatures for an in-process part based on its early-layer thermal signatures. To respect the physics in LMD, a physics-guided image selection (PGIS) mechanism is integrated with LMD-cGAN to calibrate the predictions against physical benchmarks of transient melt pool for the process. The effectiveness and efficiency of the proposed method are demonstrated in a case study on the LMD of Ti-4Al-6V thin-walled structures.

Original languageEnglish (US)
JournalIEEE Transactions on Automation Science and Engineering
StateAccepted/In press - 2022


  • Computational modeling
  • Data models
  • Laser metal deposition
  • Metals
  • Numerical models
  • Predictive models
  • Training
  • Transient analysis
  • generative adversarial net
  • physics-guided image generation.
  • surrogate model
  • thermal images

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering


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