A cost analysis of framing systems in microelectronics construction

Colby Robinson, Allan D. Chasey

Research output: Contribution to journalArticle

Abstract

Increasingly, owners of semiconductor manufacturing facilities are demanding that new wafer fabrication facilities be constructed in less time, for less money, and at higher quality levels. The structural framing systems that support wafer fabrication facility requirements are instrumental in determining how quickly a facility can be constructed and used. This article evaluates concrete versus steel for structural framing systems to determine the effect of cost and schedule of defined alternatives. Four structural alternatives of a baseline structure were selected for cost analysis. The analysis assessed the cost tradeoffs attained for the four different structural systems. Furthermore, the analysis was developed into a cost model made to be adjustable for further changes to structural material prices, structural material quantities, labor rates, structural crew sizes, and structural crew productivity rates.

Original languageEnglish (US)
Pages (from-to)26-31
Number of pages6
JournalCost Engineering (Morgantown, West Virginia)
Volume43
Issue number3
Publication statusPublished - 2001

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Keywords

  • Construction
  • Framing systems
  • Semiconductor

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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