A compressive-sensing based testing vehicle for 3D TSV pre-bond and post-bond testing data

Hantao Huang, Hao Yu, Cheng Zhuo, Fengbo Ren

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Online testing vehicle is required for 3D TSV pre-bond and post-bond testing due to high probability of TSV failures. It has become a challenge to deal with large sets of generated testing data with limited probing when transmitting the data out. In this paper, a lossless compressive-sensing based testing vehicle is developed for online testing of TSVs. By exploring sparsity of the testing data under constraint of failure bound of TSV, sparse-representation based encoding can be deployed by XOR and AND network on chip to deal with large volume of testing data. Experimental results (with benchmarks) have shown that 89.70% pre-bond data compression rate can be achieved under 0.5% probability of failures; and 88.18% post-bond data compression rate can be achieved with 5% probability of failures.

Original languageEnglish (US)
Title of host publicationISPD 2016 - Proceedings of the 2016 International Symposium on Physical Design
PublisherAssociation for Computing Machinery
Pages19-25
Number of pages7
Volume03-06-April-2016
ISBN (Electronic)9781450340397
DOIs
StatePublished - Apr 3 2016
Event2016 International Symposium on Physical Design, ISPD 2016 - Santa Rosa, United States
Duration: Apr 3 2016Apr 6 2016

Other

Other2016 International Symposium on Physical Design, ISPD 2016
CountryUnited States
CitySanta Rosa
Period4/3/164/6/16

Fingerprint

Testing
Data compression

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Huang, H., Yu, H., Zhuo, C., & Ren, F. (2016). A compressive-sensing based testing vehicle for 3D TSV pre-bond and post-bond testing data. In ISPD 2016 - Proceedings of the 2016 International Symposium on Physical Design (Vol. 03-06-April-2016, pp. 19-25). Association for Computing Machinery. https://doi.org/10.1145/2872334.2872351

A compressive-sensing based testing vehicle for 3D TSV pre-bond and post-bond testing data. / Huang, Hantao; Yu, Hao; Zhuo, Cheng; Ren, Fengbo.

ISPD 2016 - Proceedings of the 2016 International Symposium on Physical Design. Vol. 03-06-April-2016 Association for Computing Machinery, 2016. p. 19-25.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Huang, H, Yu, H, Zhuo, C & Ren, F 2016, A compressive-sensing based testing vehicle for 3D TSV pre-bond and post-bond testing data. in ISPD 2016 - Proceedings of the 2016 International Symposium on Physical Design. vol. 03-06-April-2016, Association for Computing Machinery, pp. 19-25, 2016 International Symposium on Physical Design, ISPD 2016, Santa Rosa, United States, 4/3/16. https://doi.org/10.1145/2872334.2872351
Huang H, Yu H, Zhuo C, Ren F. A compressive-sensing based testing vehicle for 3D TSV pre-bond and post-bond testing data. In ISPD 2016 - Proceedings of the 2016 International Symposium on Physical Design. Vol. 03-06-April-2016. Association for Computing Machinery. 2016. p. 19-25 https://doi.org/10.1145/2872334.2872351
Huang, Hantao ; Yu, Hao ; Zhuo, Cheng ; Ren, Fengbo. / A compressive-sensing based testing vehicle for 3D TSV pre-bond and post-bond testing data. ISPD 2016 - Proceedings of the 2016 International Symposium on Physical Design. Vol. 03-06-April-2016 Association for Computing Machinery, 2016. pp. 19-25
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