A Co-Design Approach to Understanding the Impact of Ultra-Wide-Bandgap Semiconductor Material Properties on Power Device Performance

R. Kaplar, S. Goodnick, J. Shoemaker, R. Vatan, J. Flicker, A. Binder, Srabanti Chowdhury

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Ultra-Wide-Bandgap semiconductors hold great promise for future power conversion applications. Figures of Merit (FOMs) are often used as a first means to understand the impact of semiconductor material parameters on power semiconductor performance, and in particular the Unipolar (or Baliga) FOM is often cited for this purpose. However, several factors of importance for Ultra-Wide-Bandgap semiconductors are not considered in the standard treatment of this FOM. For example, the Critical Field approximation has many shortcomings, and alternative transport mechanisms and incomplete dopant ionization are typically neglected. This paper presents the results of a study aimed at incorporating some of these effects into more realistic FOM calculations.

Original languageEnglish (US)
Title of host publication6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages116-118
Number of pages3
ISBN (Electronic)9781665421775
DOIs
StatePublished - 2022
Event6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022 - Virtual, Online, Japan
Duration: Mar 6 2022Mar 9 2022

Publication series

Name6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022

Conference

Conference6th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2022
Country/TerritoryJapan
CityVirtual, Online
Period3/6/223/9/22

Keywords

  • avalanche breakdown
  • Figure of Merit
  • low-field transport
  • power device
  • Ultra-Wide-Bandgap semiconductor

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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