TY - GEN
T1 - A 8.93-TOPS/W LSTM Recurrent Neural Network Accelerator Featuring Hierarchical Coarse-Grain Sparsity with All Parameters Stored On-Chip
AU - Kadetotad, Deepak
AU - Berisha, Visar
AU - Chakrabarti, Chaitali
AU - Seo, Jae Sun
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/9
Y1 - 2019/9
N2 - Long short-term memory (LSTM) networks are widely used for speech applications but pose difficulties for efficient implementation on hardware due to large weight storage requirements. We present an energy-efficient LSTM recurrent neural network (RNN) accelerator,featuring an algorithm-hardware co-optimized memory compression technique called hierarchical coarse-grain sparsity (HCGS). Aided by HCGS-based block-wise recursive weight compression,we demonstrate LSTM networks with up to 16× fewer weights while achieving minimal accuracy loss. The prototype chip fabricated in 65-nm LP CMOS achieves 8.93/7.22 TOPS/W for 2-/3-layer LSTM RNNs trained with HCGS for TIMIT/TED-LIUM corpora.
AB - Long short-term memory (LSTM) networks are widely used for speech applications but pose difficulties for efficient implementation on hardware due to large weight storage requirements. We present an energy-efficient LSTM recurrent neural network (RNN) accelerator,featuring an algorithm-hardware co-optimized memory compression technique called hierarchical coarse-grain sparsity (HCGS). Aided by HCGS-based block-wise recursive weight compression,we demonstrate LSTM networks with up to 16× fewer weights while achieving minimal accuracy loss. The prototype chip fabricated in 65-nm LP CMOS achieves 8.93/7.22 TOPS/W for 2-/3-layer LSTM RNNs trained with HCGS for TIMIT/TED-LIUM corpora.
KW - Hardware accelerator
KW - long short-term memory (LSTM)
KW - speech recognition
KW - structured sparsity weight compression
UR - http://www.scopus.com/inward/record.url?scp=85075908969&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85075908969&partnerID=8YFLogxK
U2 - 10.1109/lssc.2019.2936761
DO - 10.1109/lssc.2019.2936761
M3 - Conference contribution
AN - SCOPUS:85075908969
T3 - ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference
SP - 119
EP - 122
BT - ESSCIRC 2019 - IEEE 45th European Solid State Circuits Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 45th IEEE European Solid State Circuits Conference, ESSCIRC 2019
Y2 - 23 September 2019 through 26 September 2019
ER -