@inproceedings{63cc6a0edcca4da2ada4688c02ca88c8,
title = "2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects",
abstract = "With the ever-increasing data rates, interconnect performance predictability becomes more and more challenging. Therefore, along with an accurate methodology, the quantification of measurement reproducibility and its impacts are essential in almost all aspects of high-speed interconnect validation. This paper investigates the reproducibility of S-parameter measurements before and after 2x-Thru de-embedding, and illustrates a multimetric correlation with uncertainty analysis.",
keywords = "correlation, de-embedding, high-speed interconnects, measurement uncertainty, reproducibility",
author = "Geyik, {Cemil S.} and Hill, {Michael J.} and Zhichao Zhang and Kemal Aygun and Aberle, {James T.}",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022 ; Conference date: 12-12-2022 Through 14-12-2022",
year = "2022",
doi = "10.1109/EDAPS56906.2022.9995177",
language = "English (US)",
series = "IEEE Electrical Design of Advanced Packaging and Systems Symposium",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022",
}