2D Grating Pitch Mapping of a through Silicon Via (TSV) and Solder Ball Interconnect Region Using Laser Diffraction: IEEE Electronic Components and Technology Conference, 2016

Todd Houghton, Michael Saxon, Zeming Song, Hoa Nyugen, Hanqing Jiang, Hongbin Yu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

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Engineering & Materials Science

Chemical Compounds