Abstract

Planar Strain mapping of interconnects, such as Ball Grid Arrays (BGA) and Through-Silicon Vias (TSVs), is an important step in the development and testing of electronics packages, as excessive strain can lead to device failure. Today, the two most widely adopted methods of experimental strain field measurement, Digital Image Correlation and Moiré Interferometry, encounter limitations when the average strain magnitude drops below 1μm on thermally loaded samples. DIC provides only limited fields of view and increases measurement complexity, while Moiré Interferometry suffers from resolution near material interfaces. If well bonded to a surface, changes in periodicity of a thin diffraction grating can be strongly dependent on the strain field. The local grating periodicity, can then be measured using laser diffraction. We present a means of mapping the pitch of a grating bonded to the surface of a through-silicon via interconnect in two dimensions over a wide field of view, with a high degree of repeatability at room and elevated temperature.

Original languageEnglish (US)
Title of host publicationProceedings - ECTC 2016: 66th Electronic Components and Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2222-2227
Number of pages6
Volume2016-August
ISBN (Electronic)9781509012039
DOIs
StatePublished - Aug 16 2016
Event66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States
Duration: May 31 2016Jun 3 2016

Other

Other66th IEEE Electronic Components and Technology Conference, ECTC 2016
CountryUnited States
CityLas Vegas
Period5/31/166/3/16

Fingerprint

Silicon
Soldering alloys
Diffraction
Lasers
Interferometry
Ball grid arrays
Dacarbazine
Diffraction gratings
Electronic equipment
Testing
Temperature

Keywords

  • Diffraction
  • Grating
  • Laser
  • Strain
  • TSV

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Houghton, T., Saxon, M., Song, Z., Nyugen, H., Jiang, H., & Yu, H. (2016). 2D Grating Pitch Mapping of a through Silicon Via (TSV) and Solder Ball Interconnect Region Using Laser Diffraction: IEEE Electronic Components and Technology Conference, 2016. In Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference (Vol. 2016-August, pp. 2222-2227). [7545732] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2016.309

2D Grating Pitch Mapping of a through Silicon Via (TSV) and Solder Ball Interconnect Region Using Laser Diffraction : IEEE Electronic Components and Technology Conference, 2016. / Houghton, Todd; Saxon, Michael; Song, Zeming; Nyugen, Hoa; Jiang, Hanqing; Yu, Hongbin.

Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Vol. 2016-August Institute of Electrical and Electronics Engineers Inc., 2016. p. 2222-2227 7545732.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Houghton, T, Saxon, M, Song, Z, Nyugen, H, Jiang, H & Yu, H 2016, 2D Grating Pitch Mapping of a through Silicon Via (TSV) and Solder Ball Interconnect Region Using Laser Diffraction: IEEE Electronic Components and Technology Conference, 2016. in Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. vol. 2016-August, 7545732, Institute of Electrical and Electronics Engineers Inc., pp. 2222-2227, 66th IEEE Electronic Components and Technology Conference, ECTC 2016, Las Vegas, United States, 5/31/16. https://doi.org/10.1109/ECTC.2016.309
Houghton T, Saxon M, Song Z, Nyugen H, Jiang H, Yu H. 2D Grating Pitch Mapping of a through Silicon Via (TSV) and Solder Ball Interconnect Region Using Laser Diffraction: IEEE Electronic Components and Technology Conference, 2016. In Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Vol. 2016-August. Institute of Electrical and Electronics Engineers Inc. 2016. p. 2222-2227. 7545732 https://doi.org/10.1109/ECTC.2016.309
Houghton, Todd ; Saxon, Michael ; Song, Zeming ; Nyugen, Hoa ; Jiang, Hanqing ; Yu, Hongbin. / 2D Grating Pitch Mapping of a through Silicon Via (TSV) and Solder Ball Interconnect Region Using Laser Diffraction : IEEE Electronic Components and Technology Conference, 2016. Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Vol. 2016-August Institute of Electrical and Electronics Engineers Inc., 2016. pp. 2222-2227
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