27.5 A 91%-Efficiency Envelope-Tracking Modulator Using Hysteresis-Controlled Three-Level Switching Regulator and Slew-Rate-Enhanced Linear Amplifier for LTE-80MHz Applications

Parisa Mahmoudidaryan, Debashis Mandal, Bertan Bakkaloglu, Sayfe Kiaei

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Envelope tracking (ET) is widely used to improve the efficiency of linear power amplifiers (PAs) in applications such as LTE, LTE-Advanced inter- or intra-band carrier aggregation (CA), and for high-speed uplink packet access (HSUPA) with a high peak-to-average power ratio (PAPR). The hybrid ET modulator (ETM), where an efficient switching regulator (SWR) operates in parallel with a fast class-AB linear amplifier (LA), is one method to address the bandwidth (BW), power-efficiency and output ripple requirements.

Original languageEnglish (US)
Title of host publication2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages428-430
Number of pages3
ISBN (Electronic)9781538685310
DOIs
StatePublished - Mar 6 2019
Event2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 - San Francisco, United States
Duration: Feb 17 2019Feb 21 2019

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume2019-February
ISSN (Print)0193-6530

Conference

Conference2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
CountryUnited States
CitySan Francisco
Period2/17/192/21/19

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Mahmoudidaryan, P., Mandal, D., Bakkaloglu, B., & Kiaei, S. (2019). 27.5 A 91%-Efficiency Envelope-Tracking Modulator Using Hysteresis-Controlled Three-Level Switching Regulator and Slew-Rate-Enhanced Linear Amplifier for LTE-80MHz Applications. In 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 (pp. 428-430). [8662305] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2019.8662305