The Development of In-plane Strain Sensing System Using a Laser Scanning Technique The Development of In-plane Strain Sensing System Using a Laser Scanning Technique In this project, the ASU team, Professors Hongbin Yu and Hanqing Jiang, will transfer what they have developed in the last three years on the in-plane strain sensing technique, to an Intel donated QV606 system. In-plane strain mapping is critical in the understanding and the design of advanced microelectronics. The development of this strain mapping tool will allow the strain measurement of Intels samples at desired temperatures. Below is the budget for the project, including optical components for the modification of the QV system, fabrication cost, and students and faculty support.
|Effective start/end date||3/1/15 → 5/31/16|
- INDUSTRY: Domestic Company: $200,000.00
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