PERFORMANCE MODELING FOR THE DESIGN OF A SEMICONDUCTOR PACKAGE ASSEMBLY PROCESS

Project: Research project

Project Details

Description

PERFORMANCE MODELING FOR THE DESIGN OF A SEMICONDUCTOR PACKAGE ASSEMBLY PROCESS PERFORMANCE MODELING FOR THE DESIGN OF A SEMICONDUCTOR PACKAGE ASSEMBLY PROCESS
StatusFinished
Effective start/end date7/16/9810/15/98

Funding

  • INDUSTRY: Domestic Company: $3,671.00

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