High Resolutioin Three Demensional (3D) X-Ray Tomography for Detection of Defects and Simulation of Properties in Electronic Packing

Project: Research project

StatusFinished
Effective start/end date2/1/093/12/12

Funding

  • OTHER: Domestic Non-ABOR University: $280,536.00

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Tomography
X rays
Defects
Electronics packaging
Soldering alloys
Visualization
Finite element method
Polishing
Toxicity
Semiconductor materials
Copper
Industry
Lead-free solders