Finite Element Structural Dynamic Modeling Of Electronic Boards Finite Element Structural Dynamic Modeling Of Electronic Boards Honeywell, as much of the electronics community, is facing the need to change its soldering practice to use lead free materials. Key for Honeywell is the fatigue life prediction of the boards produced in this manner and it (with J. Juarez in the lead) has thus initiated a comprehensive testing effort aimed at establishing S-N curve data to support new design practices of the solder joints. For this testing effort to be fully successful, it is highly desirable to also have a parallel modeling effort that will provide a broader perspective on the boards experimental response that can be captured by the sensors in the tests. Electronic boards are very complex structural systems in that: (1) the board is a layered structure with inhomogenous layers (2) have a complex mass distribution induced by the components on the board (3) have boundary conditions that need to be characterized between the board and its support. Clearly, finite element modeling has the capability to address all of the above challenges and the construction of such models is the goal of the proposed effort. Nevertheless, this construction is a challenging problem which should be undertaken in steps. J. Juarez has planned a gradual testing effort that will permit the development of the finite element model through the measurement of the dynamic response from which natural frequencies and some mode shape information will be obtained. Phase I: The first phase of the testing and modeling involves a metallic plate supported exactly as the actual board would be. This round of testing will provide the background data for a first model of the boundary conditions implies by the board attachment. Phase II: The second phase of the testing will focus on the characterization of the bare board structural properties. A first estimate of the boundary conditions will be drawn from the Phase I results although it is expected that some fine tuning of these conditions may be necessary. Otherwise, the modeling effort will focus on matching natural frequencies and any mode shape information obtained during testing by an appropriate selection of the layers properties. Phase III: The last phase of the proposed effort is to develop a full board model involving its components modeled as rigid sub-components. Key again will be validation of the finite element predictions of natural frequencies and mode shapes with the experimental measurements. If repeat data or test results of multiple similar parts is available, the above procedure will be carried out to provide not only a mean description but also variability on the finite element properties, e.g. of the boundary conditions.
|Effective start/end date||11/2/11 → 12/16/11|
- INDUSTRY: Domestic Company: $10,000.00
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