CAREER: NOVEL ENVIRONMENTALLY-BENIGN SOLDERS FOR ELECTRONIC PACKAGING: THERMOMECHANICAL BEHAVIOR AND CHARACTERIZATION

  • Chawla, Nikhilesh (PI)

Project: Research project

Project Details

StatusFinished
Effective start/end date2/1/01 → 1/31/08

Funding

  • National Science Foundation (NSF): $524,729.00
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