C1 Project: Tunable Strain Sensor with Nanoscale Resolution Based on Buckled Thin Films CONNECTION ONE PROJECT ACCOUNT: Tunable Strain Sensor with Nanoscale Resolution Based on Buckled Thin Films This project seeks to explore the application of a newly developed buckled thin film grating for high sensitivity strain sensing of microelectronic packages and extending to backend films in semiconductor wafers. The grating will be directly fabricated on the packages under study, which makes the grating periods change as the local strain changes. Such changes will be recorded with optical system, while the scanning across the sample surface will allow the 2D spatial mapping of the strain change. Problems to be addressed: Fill the gap of Intels in-plane strain measurement metrology roadmap in sub-micron regime Enable better understanding of Silicon backend, FLI, passives and package substrate response; and serve as a validation tool for numerical analysis involving these areas Prepare Intel for mechanical characterization of future advanced package technologies Objective Find a low-cost, largely scalable (size and shape) measurement solution for nano-scale deformation based on thin film buckling behavior
|Effective start/end date||8/1/13 → 8/1/14|
- INDUSTRY: Various Consortium Members: $95,142.00
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