Engineering & Materials Science
Soldering alloys
Intermetallics
Lead-free solders
Interdiffusion (solids)
Copper
Anisotropy
Fatigue of materials
Melting
Powders
Nanoindentation
Durability
Microelectronics
Fatigue damage
Temperature
Lasers
Plastics
3D printers
Abutments (bridge)
Microstructure
Ball grid arrays
Liquids
Strain rate
Laser beams
Experiments
Plasticity
Molecular dynamics
Electron diffraction
Piles
Crack initiation
Mechanical properties
Silicon
Geometry
Crystals
Electron beam melting
Cracks
Hot Temperature
Thermal cycling
Ultrasonics
Crack propagation
Creep
Three dimensional integrated circuits
Elastic moduli
Integrated circuits
Characterization (materials science)
Fabrication
Materials properties
Yield stress
Single crystals
Chemical Compounds
Soldering alloys
Intermetallics
Copper
Carbon Nanotubes
Anisotropy
Powders
Melting
Nanoindentation
Interdiffusion (solids)
Ultrafine
Temperature
Silicon
Strain rate
Lead-free solders
Microelectronics
Laser beams
Lasers
Microstructure
titanium alloy (TiAl6V4)
3D printers
Plasticity
Finite element method
Crystals
Fatigue of materials
Electron diffraction
Plastics
Electron beam melting
Geometry
Three dimensional integrated circuits
Durability
Liquids
Molecular dynamics
Mechanical properties
Fatigue damage
Direction compound
Strength of materials
Shear stress
Single crystals
Fabrication
Experiments
Grain growth
Soldering
Ball grid arrays
Integrated circuits
Aluminum alloys
Stress analysis
Metals
Ductility
Elastic moduli
Peeling
Physics & Astronomy
solders
intermetallics
grain size
plastic properties
nanoindentation
anisotropy
strain rate
microstructure
integrated circuits
microelectronics
microbalances
multiscale models
copper
characterization
peeling
miniaturization
mechanical properties
structural design
carbon nanotubes
shear stress
stress analysis
fracture strength
crystals