Engineering & Materials Science
Abutments (bridge)
100%
Piles
66%
Powders
65%
3D printers
55%
Interdiffusion (solids)
44%
Fatigue of materials
43%
Soldering alloys
40%
Fatigue damage
34%
Intermetallics
33%
Temperature
32%
Electron beams
31%
Fusion reactions
30%
Electron beam melting
30%
Microelectronics
27%
Strength of materials
26%
Anisotropy
23%
Lasers
23%
Defects
23%
Copper
23%
Crack initiation
21%
Liquids
19%
Metals
18%
Crystal microstructure
18%
Laser beams
17%
Lead-free solders
17%
Melting point
17%
Melting
17%
Physics
17%
Crack propagation
17%
Durability
16%
Ball grid arrays
16%
Grain growth
16%
High temperature testing
15%
Microstructure
15%
Mechanical properties
15%
Cracks
15%
Plastics
15%
Materials properties
14%
Peeling
14%
Cyclic loads
14%
Porosity
14%
Stereolithography
13%
Hot Temperature
13%
Six sigma
13%
Surface roughness
13%
Thermal diffusivity
13%
Bending tests
12%
Fracture toughness
12%
Mechanical testing
11%
Geometry
11%
Chemical Compounds
Additive
39%
Electron Beam Melting
33%
Electron Beam
24%
Strength
21%
Anisotropy
21%
Surface Roughness
19%
Solder
19%
Mechanical Fatigue
18%
Fracture Toughness
16%
Fatigue Strength
16%
Interdiffusion
15%
Creep
14%
Grain Size
13%
Thermal Diffusivity
13%
Intermetallic Compound
12%
Grain Growth
12%
Shear Stress
11%
Tensile Strength
11%
Microstructure
11%
Porosity
11%
Metal
10%
Heat Capacity
10%
Thermal Conductivity
9%
Energy
8%
Thermodynamic Property
8%
Strain
8%
Pressure
8%
Shear
8%
Ambient Reaction Temperature
8%
Electron Particle
8%
Surface Defect
7%
Alloy
7%
Heat
7%
Cooling
7%
Ductility
6%
Conductivity
6%
Melting
6%
Chemical Transformation
6%
Volume
5%
Young's Modulus
5%
Liquid
5%
Crack Initiation
5%
Physics & Astronomy
intermetallics
19%
solders
14%
peeling
14%
integrated circuits
13%
anisotropy
12%
mechanical properties
12%
fracture strength
11%
microbalances
11%
manufacturing
10%
statistical analysis
10%
beds
9%
shear stress
8%
strain rate
8%
surface roughness
8%
lithography
8%
tensile strength
7%
microstructure
7%
damage
7%
fabrication
6%
assembly
6%
characterization
5%
notches
5%
ductility
5%
liquids
5%
modulus of elasticity
5%