Calculated based on number of publications stored in Pure and citations from Scopus
1900 …2022

Research activity per year

Network

G. E. Stillman

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana Champaign
  • Honeywell Corporate Technology Center
  • Honeywell
  • Electrical Engineering Research Laboratory
  • Electrical Engineering Research Laboratory Materials Research Laboratory
  • Materials Research Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Electrical Engineering Research Laboratory
  • Coordinated Science Laboratory
  • Materials Research Laboratory

External person

M. K. Mikhov

  • Arizona State University
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • Dept. Elec. Eng. Ctr. Solid State E.
  • Department of Electrical Engineering
  • Arizona State University

External person

L. Chen

  • Arizona State University
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Center for Solid State Electronics Research

External person

R. Bhat

  • Bellcore
  • Bank, NJ, USA
  • Navesink Research Center
  • Bell Communications Research
  • Red Bank, NJ, USA
  • Navesink Research and Engineering Center
  • Bell Communications Research Inc,
  • Telcordia Technologies
  • Bell Communications Research
  • Bell Communications Research
  • Bellcore
  • Bellcore

External person

K. C. Palle

  • Arizona State University
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Arizona State University

External person

M. C. Tamargo

  • Bellcore
  • City University of New York
  • Telcordia Technologies
  • Department of Chemistry

External person

M. Dudley

  • Stt. Univ. of New York Stony Brook
  • State Univ. New York at Stony Brook
  • SUNY Stony Brook
  • State University of New York at Stony Brook
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Materials Science and Engineering

External person

T. S. Low

  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • Honeywell
  • Electrical Engineering Research Laboratory Materials Research Laboratory
  • Coordinated Science Laboratory

External person

J. L. De Miguel

  • Bellcore
  • Telcordia Technologies

External person

I. B. Bhat

  • Rensselaer Polytechnic Institute
  • Department of Electrical
  • Center for Integrated Electronics
  • ECSE Department
  • Department of Electrical, Computer and System Engineering

External person

R. E. Nahory

  • Bellcore
  • Telcordia Technologies

External person

Robert F. Davis

  • North Carolina State University
  • Carnegie Mellon University
  • NEC Corporation
  • NCSU
  • Arizona State University
  • Department of Physics
  • Dept. of Materials Sci. and Eng.
  • Department of Materials Engineering
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Materials Research Center
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Physics
  • Photonic/Wireless Device Res. Labs.
  • Department of Engineering
  • Center for Solid State Science
  • North Carolina
  • North Carolina State University
  • Steelmaking Research

External person

G. L. Martinez

  • Centre Nationale de la Recherche Scientifique
  • CNRS
  • Arizona State University
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • Service Nationale des Champs Intenses
  • CNRS Centre National de la Recherche Scientifique
  • Dept. Elec. Eng. Ctr. Solid State E.

External person

Y. Wang

  • Arizona State University
  • Department of Electrical Engineering
  • Dept. Elec. Eng. Ctr. Solid State E.
  • Electrical Engineering Department
  • Rensselaer Polytechnic Institute

External person

T. Gehoski

  • Motorola
  • Phys. Sciences Research Laboratories
  • Materials Technology Laboratories

External person

K. Moore

  • Motorola
  • Phys. Sciences Research Laboratories
  • Materials Technology Laboratories

External person

Daniel H. Robinson

  • Colorado State University
  • University of Texas at Austin
  • School of Education
  • Department of Educational Psychology

External person

M. Koza

  • Bellcore
  • Bell Communications Research
  • Telcordia Technologies

External person

H. Yamane

  • Tohoku University
  • Inst. for Adv. Mat. Processing
  • Inst. Multidisc. Res. for Adv. Mat.
  • Institute of MRAM

External person

F. J. DiSalvo

  • Cornell University
  • Department of Chemistry and Chemical Biology
  • Department of Chemistry
  • Department of Chemistry
  • Princeton University

External person

M. Aoki

  • Tohoku University
  • Inst. for Adv. Mat. Processing
  • Inst. Multidisc. Res. for Adv. Mat.
  • Institute of MRAM

External person

S. Sivananthan

  • University of Illinois at Chicago
  • Univ of Illinois at Chicago
  • Phys. Dept., Univ. Illinois Chicago
  • Arizona State University
  • Microphysics Laboratory
  • Microphysics Laboratory
  • Microphysics Laboratory
  • Microphysics Laboratory

External person

B. P. Wagner

  • North Carolina State University
  • Northrop Grumman
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Materials Sci. and Eng.
  • Department of Materials Science and Engineering
  • Mission Systems
  • North Carolina State University

External person

S. M. Shibli

  • Telcordia Technologies

External person

Paul Rayes

  • Arizona State University
  • School of Electrical
  • Electrical Engineering Department
  • Arizona State University

External person

J. Bai

  • SUNY Stony Brook
  • State University of New York at Stony Brook
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Materials Science and Engineering

External person

Wei Liu

  • University of Florida
  • Scalable Network Technologies, Inc.
  • Corning Inc.
  • Scalable Network Technologies
  • Corning Incorporated
  • Arizona State University
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • University of Limerick
  • Department of Biophysics
  • The Ohio State University
  • Department of Chemical and Environmental Sciences
  • Biophysics Program
  • Department of Molecular Biology
  • Scripps Research Institute
  • IEEE
  • Biophysics Program
  • Department of Electrical Engineering

External person

D. M. Hwang

  • Bellcore
  • Bell Communications Research
  • Telcordia Technologies

External person

Giby Samson

  • Advanced Micro Devices
  • Arizona State University
  • Advanced Micro Devices
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • IEEE
  • Arizona State University

External person

S. S. Bose

  • University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory Materials Research Laboratory
  • Electrical Engineering Research Laboratory

External person

J. W. Hutchins

  • Arizona State University
  • Department of Electrical Engineering
  • Arizona State University

External person

Megan O'Donnell

  • Arizona State University
  • Arizona State University, Sensor, Signal and Information Processing Center Center

External person

C. Li

  • Rensselaer Polytechnic Institute
  • University of Arizona
  • Department of Geosciences
  • ECSE Department

External person

C. D. Poweleit

  • American Physical Society
  • Arizona State University
  • Physics and Astronomy
  • Department of Physics
  • Center for Solid State Science
  • American Physical Society

External person

B. Lee

  • University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory Materials Research Laboratory
  • Electrical Engineering Research Laboratory

External person

R. Wang

  • Rensselaer Polytechnic Institute
  • ECSE Department

External person

Y. Ding

  • The Ohio State University
  • Department of Physics
  • Department of Physics

External person

S. Mahajan

  • Arizona State University
  • Chemical Engineering
  • School for Engineering of Mass Transport and Energy
  • School of Materials
  • Department of Chemical and Materials Engineering
  • Department of Chemical and Materials Engineering

External person

H. Meidia

  • Arizona State University
  • Chemical Engineering
  • Department of Chemical and Materials Engineering
  • Department of Electrical Engineering and Center for Solid State Electronics Research
  • Arizona State University

External person

J. P. Pelz

  • The Ohio State University
  • Department of Physics
  • Department of Physics
  • Department of Physics

External person

X. Gao

  • Arizona State University
  • School of Electrical Computer and Energy Engineering
  • School of Electrical
  • Fulton School of Engineering

External person

Hector Erives

  • University of Texas at El Paso

External person

V. Seetharam

  • Arizona State University
  • School of Electrical Computer and Energy Engineering
  • School of Electrical
  • Fulton School of Engineering

External person

Russell D. Dupuis

  • Georgia Institute of Technology
  • University of Texas at Austin
  • United States Army Research Office
  • Univ of Texas
  • The University of Texas at Austin
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • Arizona State University
  • Center for Compound Semiconductors
  • School of Materials Science and Engineering
  • Center for Compound Semiconductors
  • School of Electrical and Computer Engineering
  • Microelectronics Research Center
  • School of Materials Science
  • School of Materials Science and Engineering
  • School of Materials Science and Engineering
  • Microelectronics Research Center
  • Center for Compound Semiconductors and School of Electrical and Computer Engineering
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • Microelectronics Research Center
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • Department of Electrical and Computer Engineering
  • School of Materials Science and Engineering, Georgia Institute of Technology
  • University of Texas at Austin
  • Georgia Institute of Technology

External person

John Quick

  • Arizona State University
  • Mary Lou Fulton Teachers College
  • School of Computing
  • Informatics

External person

T. R. Lepkowski

  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory Materials Research Laboratory

External person

H. H. Farrell

  • Bellcore
  • Telcordia Technologies

External person

Caleb Redshaw

  • Arizona State University
  • Arizona State University

External person

Qiao Wang

  • Arizona State University
  • School of Electrical, Computer and Energy Engineering
  • School of Arts
  • School of Electrical
  • School of Electrical
  • School of Arts
  • School of Arts
  • Media Laboratory
  • School of Electrical
  • Arizona State University

External person

C. J. Sandroff

  • Bank, NJ, USA
  • Bell Communications Research
  • Telcordia Technologies
  • Bell Communications Research

External person

Yih Fang Huang

  • Arizona State University
  • University of Notre Dame
  • College of Engineering
  • School of Electrical
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

B. Raghothamachar

  • State Univ. New York at Stony Brook
  • SUNY Stony Brook
  • Dept. of Mat. Sci. and Engineering
  • Materials Science and Engineering
  • Department of Biomedical Informatics

External person

K. B. Park

  • The Ohio State University
  • Department of Physics
  • Department of Physics
  • Department of Physics

External person

J. Jayapalan

  • Arizona State University
  • Department of Electrical Engineering
  • Arizona State University

External person

M. L. Wong

  • Arizona State University
  • Arizona State University

External person

P. J. Hartlieb

  • Clemson University
  • North Carolina State University
  • Department of Chemistry
  • Department of Materials Science
  • Dept. of Materials Sci. and Eng.
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Chemistry
  • North Carolina State University

External person

T. P. Chow

  • Rensselaer Polytechnic Institute
  • Center for Integrated Electronics

External person

D. B. Poker

  • Oak Ridge National Laboratory
  • Arizona State University
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • Solid State Division
  • Arizona State University

External person

Jinhai Chen

  • Arizona State UniVersity
  • Arizona State University
  • Cancer Research Institute
  • Department of Chemistry and Biochemistry
  • Cancer Research Institute
  • Department of Chemistry and Biochemistry
  • Department of Chemistry and Biochemistry
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

H. Zhao

  • N.C. State Univ
  • North Carolina State University
  • Arizona State University

External person

Petru Andrei

  • Florida A and M University

External person

M. L. Nakarmi

  • Kansas State University
  • Department of Physics

External person

L. R. Bryant

  • Arizona State University
  • Department of Electrical Engineering
  • Arizona State University

External person

Y. Wang

  • Rensselaer Polytechnic Institute
  • Center for Integrated Electronics

External person

H. S. Kong

  • Cree Research, Inc.
  • Cree, Inc.
  • Arizona State University
  • North Carolina State University
  • Department of Materials Engineering
  • Inc.
  • North Carolina State University

External person

J. K. Kim

  • Rensselaer Polytechnic Institute
  • Center for Integrated Electronics

External person

B. Parameshwaran

  • Arizona State University
  • Department of Electrical Engineering
  • Materials Engineering

External person

Bing Cheng

  • Arizona State University
  • School of Electrical
  • School of Electrical Computer and Energy Engineering

External person

W. M. Vetter

  • State University of New York at Stony Brook
  • SUNY Stony Brook
  • Department of Materials Science and Engineering
  • Department of Biomedical Informatics

External person

H. X. Liu

  • Department of Chemical Engineering
  • Arizona State University
  • Department of Chemical Engineering
  • Chem. and Mat. Eng. Department
  • Department of Chemical
  • School of Materials
  • Department of Chemical and Materials Engineering
  • Department of Chemical and Materials Engineering
  • Department of Electrical Engineering
  • Chemical Engineering
  • Department of Chemical Engineering

External person

E. Colas

  • Bellcore
  • Telcordia Technologies

External person

L. Krasnobaev

  • Arizona State University
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • Arizona State University

External person

E. Luckowski

  • Motorola
  • Materials Technology Laboratories

External person

S. A. Schwarz

  • Bellcore
  • Telcordia Technologies

External person

F. S. Turco-Sandroff

  • Bellcore
  • Telcordia Technologies

External person

Jacek K. Furdyna

  • Department of Physics, University of Notre Dame
  • University of Notre Dame
  • School of Electrical, Computer, and Energy Engineering, Arizona State University
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • Arizona State University
  • School of Electrical Computer and Energy Engineering

External person

R. P. Vaudo

  • Cree Inc.
  • Epitronics
  • Cree, Inc.
  • Inc.

External person

Angela Barrus

  • Arizona State University
  • Division of Educational Leadership and Innovation
  • School of Computing
  • Informatics

External person

J. W. Kolis

  • Clemson University
  • Department of Chemistry
  • Dept. of Chemistry
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

J. W. Yang

  • University of South Carolina
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Dept. of Elec. and Comp. Engineering
  • University of South Carolina

External person

T. J. Roth

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering

External person

Z. J. Reitmeyer

  • North Carolina State University
  • Department of Materials Science and Engineering
  • Dept. of Materials Sci. and Eng.
  • North Carolina State University

External person

Charles David Whitlatch

  • Arizona State University
  • School of Electrical
  • School of Electrical
  • Arizona State University

External person

R. F. Dalmau

  • North Carolina State University
  • Department of Materials Science and Engineering
  • Dept. of Materials Sci. and Eng.
  • Dept. of Mat. Sci. and Engineering
  • North Carolina State University

External person

P. D. Dapkus

  • University of Southern California
  • Rockwell International
  • Microelectronics Research & Development Cent
  • Ming Hsieh Department of Electrical Engineering
  • Department of Electrical Engineering
  • University of Southern California

External person

Asif Khan

  • University of South Carolina
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Sandia National Laboratories NM
  • University of South Carolina

External person

Charles E. Weitzel

  • Motorola
  • Materials Technology Laboratories

External person

R. Schlesser

  • North Carolina State University
  • Department of Materials Science and Engineering
  • Department of Physics
  • Dept. of Materials Sci. and Eng.
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Department of Materials Science and Engineering
  • North Carolina State University

External person

J. Y. Lin

  • Kansas State University
  • Arizona State University
  • Department of Physics
  • Department of Physics
  • Physics and Astronomy

External person

P. A. Losee

  • Rensselaer Polytechnic Institute
  • Center for Integrated Electronics

External person

V. M. Phanse

  • Epitronics

External person

M. T. Leonard

  • Cree Research, Inc.
  • Cree, Inc.
  • Arizona State University
  • Inc.

External person

H. Cheng

  • 3M
  • 3M Company, 201-1N-35, 3M Center
  • 3M Pharmaceuticals

External person

U. Chowdhury

  • Georgia Institute of Technology

External person

S. S. Chan

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering and Coordinated Science Laboratory
  • Coordinated Science Laboratory

External person

B. E. McNamara

  • Arizona State University
  • School of Electrical Computer and Energy Engineering
  • School of Electrical

External person

W. Sun

  • University of South Carolina
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • University of South Carolina

External person

J. D. Oberstar

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering and Coordinated Science Laboratory
  • Department of Electrical Engineering
  • Coordinated Science Laboratory

External person

W. M. Vetter

  • Stt. Univ. of New York Stony Brook
  • SUNY Stony Brook
  • Department of Materials Science
  • Materials Science and Engineering
  • Department of Biomedical Informatics

External person

Z. Sitar

  • North Carolina State University
  • Department of Materials Science and Engineering
  • Department of Physics
  • Dept. of Materials Sci. and Eng.
  • Department of Physics
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • North Carolina State University

External person

J. Harbison

  • Bell Communications Research
  • Navesink Research Center
  • Bellcore
  • Telcordia Technologies

External person

Y. P. Chen

  • University of Illinois at Chicago
  • Univ of Illinois at Chicago
  • United States Army Research Laboratory
  • EPIR, Ltd.
  • 410 N. Weber Road
  • AMSRL-SE-EI
  • EPIR Ltd.
  • EPIR Technologies, Inc
  • Microphysics Laboratory
  • Microphysics Laboratory
  • Sensors and Electron Devices Directorate
  • EPIR Technologies, Inc.

External person

C. Q. Chen

  • Huazhong University of Science and Technology
  • University of South Carolina
  • College of Optoelectronic Science and Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

Bhargav Korrapati

  • Arizona State University
  • School of Electrical Computer and Energy Engineering
  • Fulton School of Engineering

External person

S. M. Shibli

  • Bellcore
  • Telcordia Technologies

External person

R. J. Molnar

  • Massachusetts Institute of Technology
  • Massachusetts Inst. of Technology
  • The Ohio State University
  • Lincoln Laboratory
  • Lincoln Laboratory
  • 205 Dreese Laboratory

External person

T. J. Gmitter

  • Navesink Research Center
  • Bell Communications Research
  • Bellcore
  • Telcordia Technologies

External person

E. F. Schubert

  • Rensselaer Polytechnic Institute
  • Center for Integrated Electronics

External person

H. X. Jiang

  • Kansas State University
  • Arizona State University
  • Department of Physics
  • Department of Physics
  • Physics and Astronomy

External person

E. Michaels

  • Clemson University
  • Department of Chemistry
  • Dept. of Chemistry

External person

D. Ganser

  • Motorola
  • Materials Technology Laboratories

External person

E. Yablonovitch

  • Navesink Research Center
  • Bell Communications Research
  • Bellcore
  • Telcordia Technologies
  • University of California at Berkeley
  • Department of Electrical Engineering and Computer Sciences

External person

Ramachandran Venkatasubramanian

  • Broadcom Corporation
  • Arizona State University
  • Broadcom Corporation
  • Electrical Engineering Department
  • Arizona State University

External person

S. Balachandran

  • Rensselaer Polytechnic Institute
  • Center for Integrated Electronics

External person

G. E. Bulman

  • Cree Research, Inc.
  • Cree, Inc.
  • Arizona State University
  • Inc.

External person

J. K. Abrokwah

  • Honeywell Corporate Technology Center
  • Honeywell

External person

T. S. Frank

  • South Mountain Community College
  • Engineering Program

External person

J. C. Bischoff

  • Bank, NJ, USA
  • Bell Communications Research
  • Telcordia Technologies
  • Bell Communications Research

External person

R. N. Nottenburg

  • Bank, NJ, USA
  • Bell Communications Research
  • Telcordia Technologies
  • Bell Communications Research

External person

X. R. Huang

  • Stt. Univ. of New York Stony Brook
  • State University of New York at Stony Brook
  • SUNY Stony Brook
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering

External person

F. Deng

  • Univ. of California at San Diego
  • University of California at San Diego
  • Cent for Low Power Electronics
  • Arizona State University
  • Dept. of Comp. and Elec. Engineering
  • Department of Electrical and Computer Engineering, University of California at San Diego
  • Cent for Low Power Electronics

External person

TS Ravi

  • Bellcore
  • Arizona State Univ, Tempe, AZ, USA
  • Arizona State University
  • Telcordia Technologies
  • Department of Chemical

External person

J. W. Mayer

  • California Institute of Technology
  • University of California at San Diego
  • Cornell University
  • University of California at San Diego
  • Arizona State University
  • Department of Chemistry
  • School of Materials
  • Department of Chemical Engineering
  • Department of Chemical
  • Department of Chemical and Materials Engineering
  • Dept. of Chemical and Materials Engineering
  • IMEC
  • Department of Chemical and Materials Engineering
  • Department of Materials Science and Engineering
  • Chemical Engineering
  • Center for Solid State Science
  • Chem. and Mat. Eng. Department
  • Department of Materials Science and Engineering
  • School of Material Sciences
  • Department of Materials Science and Engineering
  • Cancer Research Institute
  • Department of Materials Science and Engineering
  • Cornell University College of Engineering
  • Cornell University
  • Arizona State University

External person

J. F. Schetzina

  • N.C. State Univ
  • North Carolina State University

External person

X. Wang

  • Arizona State University
  • School of Electrical

External person

F. S. Turco

  • Telcordia Technologies

External person

J. A. Edmond

  • N.C. State Univ
  • North Carolina State University

External person

D. Wang

  • Arizona State University

External person

S. S. Lau

  • California Institute of Technology
  • University of California at San Diego
  • University of California at San Diego
  • Univ. of California at San Diego
  • Cent for Low Power Electronics
  • Arizona State University
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Dept. of Comp. and Elec. Engineering
  • Department of Electrical Engineering

External person

R. J. Deri

  • Bell Communications Research
  • Telcordia Technologies

External person

M. Kim

  • University of Illinois at Urbana-Champaign

External person

Atul Mahajan

  • Arizona State University
  • Ctr. Solid State Electronics Res.

External person

J. Simpson

  • Heriot-Watt University
  • Department of Physics

External person

M. J S P Brasil

  • Bellcore
  • Telcordia Technologies

External person

A. L. Weaver

  • Bellcore
  • Telcordia Technologies

External person

K. P. Giapis

  • California Institute of Technology
  • Arthur Amos Noyes Laboratories

External person

K. Akimoto

  • University of Tsukuba
  • Institute of Material Science

External person

G. C. Nihous

  • Pacific International Center of High Technology Research

External person

R. J. Martin

  • Telcordia Technologies

External person

Ana Chavez

  • University of Texas at El Paso

External person

O. F. Sankey

  • Center for Solid State Science Arizona State University
  • Jacksonville State University
  • Arizona State Univ., Tempe, AZ, USA
  • Los Alamos Natl Lab
  • Los Alamos National Laboratory
  • Arizona State University
  • Center for Solid State Electronics Research
  • Physics and Astronomy
  • Center for Solid State Science
  • Center for Solid State Science
  • Department of Physics
  • Physics Department
  • Auburn University

External person

Guillermo G. Mendez

  • Arizona State University
  • Department of Mathematics and Statistics

External person

W. I. Lee

  • Varian Research Center
  • Varian, Inc.

External person

Bailey DeAnna

  • Morgan State University

External person

Jing Jing Li

  • Arizona State University
  • Center for Photonic Innovation
  • School of Electrical Computer and Energy Engineering
  • Center for Nanophotonics
  • Arizona State University

External person

Yu Hwa Lo

  • Arizona State University
  • Telcordia Technologies
  • Arizona State University

External person

S. Smith

  • Motorola
  • Phys. Sciences Research Laboratories

External person

Xinyu Liu

  • Department of Physics, University of Notre Dame
  • University of Notre Dame
  • Department of Physics
  • Department of Physics
  • Department of Physics

External person

Herbert M. Cox

  • Red Bank, NJ, USA
  • Bell Communications Research Inc,
  • Telcordia Technologies
  • Alcatel-Lucent
  • Lucent

External person

Leijun Yin

  • Arizona State University
  • School of Electrical Computer and Energy Engineering
  • Department of Physics
  • School of Electrical
  • Center for Photonic Innovation
  • Ira A. Fulton School of Engineering
  • Center for Solid State Science
  • Arizona State University

External person

G. N. Ali

  • Arizona State University
  • Department of Electrical Engineering

External person

R. Y. DeJule

  • University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory

External person

M. H. Kim

  • University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory Materials Research Laboratory

External person

P. Mei

  • Telcordia Technologies

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L. Wang

  • University of Illinois at Chicago
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Lijun Wu

  • Brookhaven National Laboratory
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Willie L. Thompson

  • Morgan State University

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K. F. Jensen

  • Massachusetts Institute of Technology
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Dingjie Wang

  • Arizona State University
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J. V. McManus

  • Advanced Technology Materials, Inc.

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S. G. Hummel

  • University of Southern California
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M. R. Curiel

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J. W. Cook

  • N.C. State Univ
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M. H. Meynadier

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I. S. Hauksson

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L. Nazar

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C. R. Abernathy

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H. M. Manasevit

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G. M. Metze

  • Massachusetts Institute of Technology
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T. Thompson

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O. L. Hartin

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C. Boney

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S. Xin

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T. J. Roth

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M. G. Miller

  • Freescale Semiconductor

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P. A. Grudowski

  • Univ of Texas
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M. A L Johnson

  • N.C. State Univ
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B. Goldenberg

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S. Sivananthan

  • University of Illinois at Chicago
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A. R. Calawa

  • Massachusetts Institute of Technology
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A. Sasikumar

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R. J. Martin

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K. Hess

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R. Sporken

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Miguel Velez

  • University of Texas at El Paso

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S. C Y Tsen

  • Univ of Illinois at Urbana-Champaign
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J. A. Aguilar

  • University of Illinois at Urbana-Champaign

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Stephen J. Pearton

  • University of Florida
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E. Sutter

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Hui Chen

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  • Honeywell

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T. S. Low

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H. Zhao

  • Arizona State University
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G. N. Ali

  • Arizona State University
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D. Ding

  • School of Electrical, Computer and Energy Engineering, Arizona State University
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  • Motorola
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T. Venkatesan

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V. Vaidyanathan

  • Arizona State University
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Yimei Zhu

  • Brookhaven National Laboratory
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Y. Wang

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N. C. Tien

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Shatrughn Gupta

  • Arizona State University

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S. Wang

  • Arizona State University
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R. Morton

  • University of California at San Diego
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Michael Dudley

  • SUNY Stony Brook
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C. B. Hoffman

  • Cornell University
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K. Arai

  • University of Illinois at Urbana-Champaign

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C. A. Beyler

  • University of Southern California
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