Fingerprint The fingerprint is based on mining the text of the scientific documents related to the associated persons. Based on that an index of weighted terms is created, which defines the key subjects of research unit

Solar cells Engineering & Materials Science
Silicon Engineering & Materials Science
Electric potential Engineering & Materials Science
Networks (circuits) Engineering & Materials Science
Sensors Engineering & Materials Science
Data storage equipment Engineering & Materials Science
Heterojunctions Engineering & Materials Science
Antennas Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output 1983 2019

24.5 A Twin-8T SRAM Computation-In-Memory Macro for Multiple-Bit CNN-Based Machine Learning

Si, X., Chen, J. J., Tu, Y. N., Huang, W. H., Wang, J. H., Chiu, Y. C., Wei, W. C., Wu, S. Y., Sun, X., Liu, R., Yu, S., Liu, R. S., Hsieh, C. C., Tang, K. T., Li, Q. & Chang, M. F., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 396-398 3 p. 8662392. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Static random access storage
Macros
Learning systems
Data storage equipment
Energy efficiency

25.2 A Reconfigurable RRAM Physically Unclonable Function Utilizing Post-Process Randomness Source with <6×10 -6 Native Bit Error Rate

Pang, Y., Gao, B., Wu, D., Yi, S., Liu, Q., Chen, W. H., Chang, T. W., Lin, W. E., Sun, X., Yu, S., Qian, H., Chang, M. F. & Wu, H., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 402-404 3 p. 8662307. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bit error rate
Silicon
Authentication
Cryptography
RRAM

27.5 A 91%-Efficiency Envelope-Tracking Modulator Using Hysteresis-Controlled Three-Level Switching Regulator and Slew-Rate-Enhanced Linear Amplifier for LTE-80MHz Applications

Mahmoudidaryan, P., Mandal, D., Bakkaloglu, B. & Kiaei, S., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 428-430 3 p. 8662305. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modulators
Hysteresis
Power amplifiers
Agglomeration
Bandwidth

Prizes

IEEE Fellow

Martin Reisslein (Recipient), 2014

Prize: Prize (including medals and awards)